256 megabit cmos dram dpnnd8mx32ry5 preliminary description: the dpnnd8mx32ry5 is the 8 meg x 32 dynamic ram module that utilize the new and innovative space saving tsop stacking technology. the module is constructed of four 4 meg x 16 dynamic ram?s that are configured as 2 banks of 4 meg x 32. the dpnnd8mx32ry5 provides for a compatible upgrade path to lower density compatible modules. the module features high speed access times, common data inputs and outputs, and three standard refresh modes. features: access times: 60, 70, 80ns (max.) 5.0v or 3.3v supply common data inputs and outputs edo or fast page mode capability 4096 cycles / 64 ms 3 variations of refresh: - ras only refresh - cas before ras refresh - hidden refresh package: tsop leadless stack pin-out diagram note: pin 43 and pin 46 are connected together, pin 42 and pin 45 are connected together. functional block diagram note: lcas controls dq0-dq15, ucas controlls dq16-dq31. 2mx32, 50 - 80ns, tstack 30a165-15 a this document contains information on a product presently under development at dense-pac microsystems, inc. dense-pac reserves the right to change products or specifications herein without prior notice. pin names a0 - a11 row address: a0 - a11 column address: a0 - a9 refresh address: a0 - a11 dq0 - dq31 data in / data out ucas upper column addres strobe lcas lower column addres stobe ras 0 - ras 1 row address enables we 0 - we 1 data write enables oe 0 - oe 1 data output enables v dd power supply (+5v) v ss ground n.c. no connect 30a165-15 rev. a 1
dpnnd8mx32ry5 dense-pac microsystems, inc. preliminary mechanical drawing dense-pac microsystems, inc. 7321 lincoln way ? garden grove , california 92841-1431 (714) 898-0007 (800) 642-4477 (outside ca) ? fax: (714) 897-1772 ? http://www.dense-pac.com ordering information 30a165-15 rev. a 2
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